Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...
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The Applied Endura® Impulse™ PVD system is a production-worthy, integrated solution for high-volume manufacturing (HVM) of phase-change...
The Applied Endura Clover MRAM PVD system is the first production-worthy, integrated platform for high-volume manufacturing (HVM) of...
Tungsten has been widely used as a gapfill material in middle-of-line (MOL) contacts for its low resistivity and bulk fill...
As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...
The ALTA 4700DP system provides cost-effective patterning of binary masks and phase shifting masks (PSM), supporting fast turnaround and...
The Applied Aera4 Mask Inspection system is a fourth-generation 193nm-based inspection tool unique in combining true aerial imaging with...
The Applied Aeris-G system is a pre-pump plasma abatement solution that uses less energy by treating the actual process gas volume—a...
Designed to treat the “dirtiest” applications, the Aeris-S operates by converting problematic materials into compounds that can be...
Aeris-Si is an integrated solution for subfab foreline cleaning to manage silica load and improve pump lifetime. The solution enables a...
Ginestra™ is a software product designed to simulate the operation and electrical characteristics of modern logic (e.g., FinFET, FeFET)...
Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...
Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...
The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...
Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...
The groundbreaking Applied Centris platform clusters up to eight process chambers – six etch and two plasma clean chambers. A high-speed...
As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...
These films join the broad portfolio of processes available on the Centura DxZ CVD system. The foundation of Applied’s strength in...
Applied Materials' patented Ultima HDP-CVD reactor design and process technology deposits both undoped (USG) and doped (PSG and FSG...
Advanced chamber materials reduce cost of ownership and increase throughput by making possible "clean-mode" operation. In addition,...
The Applied Avatar system combines step-to-step temperature tuning and control, which ensures the correct temperature set point...
In the DPN HD nitridation process, silicon oxide dielectric is infused with nitrogen using low-energy, pulsed plasma to create the...
The Applied Centura Epi system is a production-proven, single-wafer, multi-chamber epitaxial silicon deposition system with ~900 200mm...
New 200mm technology challenges that Applied Centura Etch Reactors address include: silicon etching of aspect ratios >100:1 for MEMS...
