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Raider®-S ECD

The Raider-S is a high-volume single-wafer electroplating tool for TSV and wafer-level packaging applications. It features a fully automated precision wafer handling system and multiple process chambers and is compatible with automated chemical management systems.


  • Advanced metal deposition or clean chambers
  • 15 to over 27+ process chambers
  • Incorporated chemical analysis options
  • Membrane plating technology
  • Multi-zone anode for thinned seed plating
  • Small footprint
  • 200mm or 300mm wafers

Applications ECD

  • Electrolytic metal deposition (Cu-TSV, Pillar, and SnAg bumping)