The etch process removes selected areas from the surface of the wafer so that other materials may be deposited.
Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...
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As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...
New 200mm technology challenges that Applied Centura Etch Reactors address include: silicon etching of aspect ratios >100:1 for MEMS...
In the drive to maximize the functionality-to-volume ratio, device makers are integrating chips using schemes. TSV technology...
EUV photomasks differ fundamentally from conventional photomasks that selectively transmit 193nm wavelength light to project circuit...
The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...
While offering the highest throughput density with the Twin Chambers and a two-FOUP, dual robot factory interface, Producer Etch...
The Producer® Selectra™ Etch system introduces unprecedented capabilities for sustaining the momentum of Moore’s Law through further...
