The etch process removes selected areas from the surface of the wafer so that other materials may be deposited.
Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...
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The groundbreaking Applied Centris platform clusters up to eight process chambers – six etch and two plasma clean chambers. A high-speed...
As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...
Advanced chamber materials reduce cost of ownership and increase throughput by making possible "clean-mode" operation. In...
The Applied Avatar system combines step-to-step temperature tuning and control, which ensures the correct temperature set point...
New 200mm technology challenges that Applied Centura Etch Reactors address include: silicon etching of aspect ratios >100:1 for MEMS...
In the drive to maximize the functionality-to-volume ratio, device makers are integrating chips using schemes. TSV technology...
EUV photomasks differ fundamentally from conventional photomasks that selectively transmit 193nm wavelength light to project circuit...
The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...
While offering the highest throughput density with the Twin Chambers and a two-FOUP, dual robot factory interface, Producer Etch...
The Producer® Selectra™ Etch system introduces unprecedented capabilities for sustaining the momentum of Moore’s Law through further...
