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In addition to thick Epi and deep reactive ion etch (DRIE), MEMS manufacturers are implementing novel materials like ultra-thick oxides (>20µm), AlN, piezo-electric materials (e.g. PZT) and low temperature CMOS compatible films such as SiGe. They are also moving to new packaging processes like through silicon vias (TSV) which facilitate device stacking.

With much of the growth from consumer devices, time to market and cost are increasing challenges for MEMS makers and increases the need for high productivity, high yield production tools. To support this, Applied is developing new 200mm capability on our production proven platforms for these and other technology challenges in the MEMS market.