Ken Collins is appointed vice president of Disruptive Technology and Engineering in the Etch Products Business Unit at Applied Materials, Inc. He first joined the company in 1984 as a radio frequency electrical engineer on the team that developed the Chemical Vapor Deposition (CVD) and Etch 5000, and later high-density plasma Etch and CVD products.
In 1993, Mr. Collins received the Dan Maydan “Innovation and Commercialization into Products” award and in 1997, he was named an Applied Materials Fellow. From 2002 through 2005 he led development of the P3i (plasma immersion ion implantation) product. In 2006, he rejoined Etch where he is currently vice president of Disruptive Technology and Engineering. Mr. Collins led the team that conceived of and developed the CentrisTM Sym3TM Etch chamber. He currently is responsible for the development of plasma source and chamber technology.
Mr. Collins has received 176 issued U.S. patents and earned his bachelor's degree in mathematics and master’s degree in engineering (thermal/fluids and electromagnetics/plasma) from San Jose State University.