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PVD(物理气相沉积)

PVD is characterized by a process in which a metal vapor is generated by sputtering or evaporation of a target material that then condenses on the wafer surface. Applied has more than 25 years of experience in PVD technology development and holds undisputed market leadership in this segment.

PVD 沉积工艺在半导体制造中用于为各种逻辑器件和存储器件制作超薄、超纯金属和过渡金属氮化物薄膜。最常见的 PVD 应用是铝板和焊盘金属化、钛和氮化钛衬垫层、阻挡层沉积和用于互连金属化的铜阻挡层种子沉积。

PVD 薄膜沉积工艺需要一个高真空的平台,在这个平台上,将 PVD 沉积工艺与脱气和表面预处理技术相集成,以获得最佳的界面和薄膜质量。应用材料公司的 Endura 平台是当前 PVD 金属化的业界黄金标准。