nanochip fab solutions
Article Library
Equipment & Materials Engineering
Benchmarking & Productivity
Advanced Process Control & Data Analytics
自動化軟體
Energy & Fab Sustainability
Parts & Services
Marketing & Industry Trends
Previous Issues
Previous Issues

Over the last year the impact of the global pandemic and the high demand for semiconductors in key markets have put tremendous pressure on customers to run fabs faster and harder than ever. In this edition of Tool Talk, Applied Global Services (AGS) is offering reminders and recommendations that may help you up your game for maintenance and service and keep your production lines humming.

現今環境下,許多產業都因晶片短缺問題而一籌莫展,半導體製造商需要新的方法來簡化其元件生產流程,並從現有的晶圓廠獲得更高的生產率。應用材料的先進規劃和排程解決方案正是為此目的而設計。

領先和後緣技術節點對半導體的強勁需求,推動著全球迫切且日益增長的各種需要,包括快速完成故障排除、修復和升級工具,以及加速安裝和產品合格鑑定速度等,以求全力加快產能。

When Semicon Europa opens in Munich, Germany, (November 14-17) it will, for the first time ever, be co-located with the long-standing European electronics show, productronica, creating a major single event for European electronics manufacturing and attracting thousands of visitors from across the electronic supply chain.

CEA Leti recently hosted the European MEMS & Sensor Summit in Grenoble, France, considered by many in More-than-Moore (MTM) circles as a must-attend event.

Industry 4.0/Smart Manufacturing and Big Data among hot topics as chip industry technologists converge to examine challenges and solutions for advanced process control (APC) in microelectronics manufacturing.

Executives at the Globalfoundries Technology Conference say 5G wireless will drive demand for highly integrated radio frequency ICs, 22FDX-based processors, and leading-edge ASICs.

The Covid-19 pandemic has accelerated collaborative-while-remote development in the semiconductor industry because travel restrictions and improved cloud security have encouraged more semiconductor fabs to allow controlled visibility into fab data, according to participants at the Advanced Process Control and Smart Manufacturing (APCSM) 2020 Conference, held virtually in early October.


近年來,發光二極體 (LED) 照明已被大量採用。雷射、光偵測器、microLED 和 光子積體電路 (PIC) 等光子元件成為一系列新技術的建構模組,包括了人臉識別、 3D 感測和雷射成像、偵測和測距(雷射雷達)等。
- 1 of 13
- next ›
Navigating Through a Changing Industry
November 2012
Look ahead to the power of predictive solutions
December 2011