Charger™ UBM PVD
The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip packaging. Specifically designed for UBM, redistribution layer (RDL), and CMOS image sensor applications, the Charger system's new linear architecture more than doubles the wafer output of competing systems to deliver the highest productivity available. In addition, proprietary Isani wafer treatment technology allows the system to process ten times more wafers between servicing for best-of-breed uptime and the lowest available per-wafer cost.
Isani wafer treatment minimizes defects on organic and high-stress films, extends process kit life, and substantially lowers the cost of consumables compared with traditional inductively coupled plasma sputter chambers. Longer process kit life both lowers production costs and increases output by reducing preventive maintenance frequency to give customers the lowest cost of ownership among packaging deposition systems.
Select magnetron and PVD chamber design improvements fulfill exacting film deposition uniformity specifications for various metals used in UBM and RDL applications (e.g., Ti, TiW, Cu, and NiV).
The Charger system's modular architecture enhances configuration flexibility, making it easy to expand a compact three-chamber R&D configuration into a five-chamber, high-volume manufacturing system with minimal downtime.