skip to main content

Metrology and Inspection

Together with metrology and wafer inspection, defect review, analysis, and classification are vital in semiconductor fabrication, providing the means to monitor and control the quality of individual steps in the manufacturing sequence.

Applied offers a full suite of metrology, inspection, and review systems for FEOL and BEOL applications. These systems’ optical capabilities and algorithms meet the most advanced technical demands, such as SADP and SAQP, extreme ultraviolet layers, measurement-intensive optimal proximity correction mask qualification, and emerging 3D architectures that make complete and accurate imaging more challenging. Their leading-edge capabilities enable chipmakers to establish accurate statistical process control, ramp up production runs rapidly, and achieve consistently high production yields.