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    Centura Prime RP Epi

    Centura® Prime® Epi

    Leveraging Applied’s epitaxy expertise gained with the industry-leading Centura RP Epi system over almost two decades, the Centura Prime...

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    Centura Silvia Etch is designed for the deep silicon etch required to create the vertical connections between chips or wafers

    Centura® Silvia® Etch

    In the drive to maximize the functionality-to-volume ratio, device makers are integrating chips using schemes. TSV technology...

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    Centura<sup>®</sup> Tetra™ EUV Advanced Reticle Etch

    Centura® Tetra™ EUV Advanced Reticle Etch

    EUV photomasks differ fundamentally from conventional photomasks that selectively transmit 193nm wavelength light to project circuit...

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    Centura® Tetra™ Z Photomask Etch

    The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...

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    Centura® Ultima HDP CVD®

    The Applied Centura Ultima HDP CVD 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading...

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    CERTIFIED REFURBISHMENT

    Our Certified Refurbishment service is a perfect solution for customers looking for a simple way to repair broken parts and save the...

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    Charger™ UBM PVD

    The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip...

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    Endura Cobalt

    Cobalt Product Suite

    Applied Materials continues to extend its technical leadership in metallization, introducing the most significant material innovation in...

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    Dispatching & Reporting

    Dispatching & Reporting

    Applied SmartFactory Dispatching & Reporting is an automated decision system that improves factory productivity and reduces...

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    Durables Management

    Durables Management

    High complexity in manufacturing requires sophisticated durable management. Such complexity can be effectively managed only through...

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    Endura® ALPS® PVD (ALPS Co & Ni)

    The Applied Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance...

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    Close up of Endura® Amber™ PVD, a proven all-in-one system combines cold deposition and high-temperature thermal copper reflow

    Endura® Amber™ PVD

    To date, ionized physical vapor deposition (PVD) has been able to achieve the required thickness and continuity of coverage on...

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    Endura® Avenir® RF PVD

    The Endura Avenir system's RF PVD technology addresses high-k/metal gate applications as well as logic contact silicidation to 22nm and...

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    Endura

    ENDURA® CIRRUS™ HT Co PVD

    As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...

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    Endura® Cirrus™ HTX PVD

    Revolutionizing physical vapor deposition (PVD) technology for titanium nitride (TiN) thin films, the Endura Cirrus HTX TiN solves...

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    MRAM

    Endura® Clover® MRAM PVD

    The Applied Endura Clover MRAM PVD system is the first production-worthy, integrated platform for high-volume manufacturing (HVM) of...

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    Endura CuBS (Copper Barrier/Seed) RFX PVD system

    Endura® CuBS RFX PVD

    The thickness tuning capability of the EnCoRe II Ta(N) chamber enables customers to reduce barrier thickness for line...

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    Endura® iLB™ PVD/ALD

    The system offers a cost-effective way of using ALD (atomic layer deposition) technology to extend customers' existing iLB PVD/CVD...

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    PCRAM System

    ENDURA® IMPULSE™ PCRAM PVD

    The Applied Endura® Impulse™ PVD system is a production-worthy, integrated solution for high-volume manufacturing (HVM) of phase-change...

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    Endura® PVD 200mm

    Emerging applications in micro-electro-mechanical systems (MEMS), CMOS image sensors and packaging technologies such as through-silicon...

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    Endura® Underbump Metallization PVD

    Active wafer temperature control and stress modulation facilitate integration between interconnect metals and solder bumps with low cost...

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    Endura<sup>®</sup> Ventura™ PVD

    Endura® Ventura™ PVD

    Designed specifically for TSV metallization, the Applied Endura Ventura PVD system is Applied’s latest innovation in physical...

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    Endura

    Endura® Versa™ XLR2 W PVD

    As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...

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    Endura® Volta® W CVD

    Tungsten has been widely used in logic contact, middle-of-line, and metal gate fill applications for its low resistivity and conformal...

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