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Semiconductor Manufacturing Equipment, Services & Automation Software

The Internet of Things, Big Data and artificial intelligence (AI) demand rapid, dramatic improvements in chip power efficiency, performance, area, cost, and time to market (PPACt). This challenge is the force behind our industry’s new playbook; to meet these demands the entire industry is beginning to collaborate in a new way. We are choosing parallel innovation over serial innovation and promoting greater collaboration across the ecosystem—from Materials to Systems™ and from Systems to Materials™—to accelerate the delivery of improved chips for the AI era.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

Our investments in state-of-the-art digital infrastructure bring together sensors, metrology, data science, machine learning, and simulation to help us shorten product development cycles; speed up transfer of new technologies from lab to fab; and optimize cost, output, and yield for our customers in volume production.

May 23 2022

Classic Moore’s Law Scaling Challenges Demand New Ways to Wire and Integrate Chips

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Apr 19 2022

Newer Ways to Shrink

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Apr 14 2022

New Ways to Shrink: Further EUV Scaling Depends on Materials Engineering and Metrology Breakthroughs

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