The expanding use of MEMS devices, including accelerometers, gyroscopes and microphones, is a major contributor to the ongoing transformation of the mobile, automotive and medical device markets. Adoption is further accelerating with the development of multi-function or “combo” sensor packages smaller MEMS device footprint enables additional capability in a similar form-factor. New materials and device integration schemes are required to enable these combo devices. These include a need to deposit and etch thick epi to enable power reduction and…
New materials and device integration schemes are required to enable these combo devices. Materials include thick epi, ultra-thick oxides (>20µm), AlN, piezo-electric materials (e.g., PZT) and low-temperature CMOS-compatible films such as SiGe. Integration includes new packaging processes like TSVs, which facilitate device stacking.
With much of the MEMs market growth driven by consumer devices, time to market and cost are growing challenges for MEMS makers and increases the need for high-productivity, high-yield production tools. To support this, Applied is developing new 200mm capability on our production-proven platforms for these and other technology challenges in the MEMS market.