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Nanochip Upcoming Events

Applied Materials participates annually in scores of industry shows, technical conferences and special events around the globe. Here are a few upcoming opportunities to meet, greet and learn from members of our technical teams. We hope to see you!
Conference  Paper or Event
Paris, France
September 30 - October 4, 2013
  "Cell Efficiency Prediction by Bare Wafer Metrology," Asaf Schlezinger, Changshi Lao(MEMC), H. -H. Liu (Gintech)
SEMICON Europa & Fab Managers Forum
Dresden, Germany
October 7 – 10, 2013
APC Conference XXV 2013
Ann Arbor, MI, USA October 14 - 17, 2013
  "Comprehensive FDC Methodology Combining FDC, Equipment and Process Expertise: Deployment Experiences," Shayne Smith, Kevin Sannes
  "Predictive Maintenance Statistical Modeling Using Obscured Data," Jimmy Iskandar, James Moyne, Parris Hawkins, Bryan Pollard (Intel), Avi Fuerst (Intel), David Stark (Independent), Gino Cripier (ISMI)
  "Predictive Maintenance Modeling on CVD Tools," Jimmy Iskandar, James Moyne, Parris Hawkins, Kommisetti Venkata, Rama Subrahmanyam, Chang Yoon (Micron). Toysha Walker (Independent), Gino Crispieri (ISMI)
  "Combining Predictive Maintenance and Virtual Metrology for Chamber Matching," Manjunath Yedatore, James Moyne
  "International Technology Roadmap for Semiconductors (ITRS) Factory Integration Major Revisions for 2013," James Moyne
International Wafer-Level Packaging Conference
San Jose, CA, USA November 5 - 7, 2013
  "Overcoming Productivity Challenges in 2.5/3D Packaging," Shekar Krishnaswamy, David Hanny
AEC/APC Symposium Asia 2013
Tokyo, Japan
November 7, 2013
  "Big Data – Big Potential for Semiconductor Manufacturing Productivity Improvement," Jamini Samantaray