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Applied Materials to Participate in Multiple Events at 2017 CSTIC and SEMICON China

Applied Materials will be prominently represented at two of China’s largest annual semiconductor technology conferences from March 13 – 16, in Shanghai.

The CSTIC 2017 Conference, organized by SEMI, IMEC, IEEE-EDS and other industry associations, will be held March 13 and 14, in conjunction with the SEMI-sponsored Semicon China trade show and technical conference which runs from March 14-16. Both events will feature extensive technical presentations and programs on all aspects of device manufacturing and advanced technology. Hot topics, such as memory technology, 3D integration, MEMS technology and adjacent technologies for display manufacturing will be addressed at the joint events.

Nine CSTIC presentations from Applied Materials will include a March 13th keynote presentation on Advanced Packaging by Scott Lin; invited presentations on advanced etch and cleaning applications by Jennifer Sun and Ganming Zhao (March 12th); and a joint paper on process stability and tool capacity improvement by Yanghua He and Michael Lube of Qorvo, Inc. and Jamie Leighton of Applied Materials (March 13th).

Among the presenters at the Semicon China Technical Sessions, Applied’s Benjamin Lee, representing the Applied Global Services group, will present on the future of power devices on Thursday, March 16.

Applied Materials also will host a Semiconductor Technical Symposium at the Jumeirah Himalaya Hotel on Wednesday, March 15. Focused on inflection-driven innovation, presentations will cover production and packaging technologies related to 28nm device fabrication. Additionally, on March 15th, Applied’s automation products group will host a technology seminar at the Marriott Pudong Hotel with presentations aimed at advanced strategies for efficient tool and factory automation.

For additional information on these and other Applied Materials events during CSTIC and Semicon China, please contact