Producer® Invia® CVD
The Producer InVia system delivers an innovative CVD process that deposits highly conformal and electrically robust dielectric liners in via-first and via-middle, and interposer TSV applications in advanced logic and memory packaging products.
The process meets conformality, and electrical and reliability requirements for advanced TSV generations with no integration issues and is the only one that satisfies the thermal budget and conformality requirements for via-middle TSV. The unique deposition process results in film breakdown voltage and leakage current that are significant improvements over the standard specifications.
The InVia system is also uniquely capable of depositing liners as thin as 200nm and as thick as 1µm over a wide range of aspect ratios (6:1 to 16:1) with no delamination or cracking issues.