The VIISta 3000XP, built on the acclaimed Varian dual-magnet single-wafer architecture, delivers the angle precision required for advanced high-energy applications.
Below the 65nm technology node, the limitations of conventional batch high-energy implanters create device performance issues for high-energy processes. Single-wafer architecture is required to achieve the precise angle control, dose control, and productivity demanded for high-volume manufacturing. The system has been developed to deliver superior metal contamination performance, which will benefit CMOS image sensor technology.
The VIISta 3000XP is also ideally suited for medium-current back-up. The system features the same single-wafer end station, dosimetry system, and wafer positioning system as the market-leading medium-current VIISta 900XP.