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PVD

PVD is characterized by a process in which a metal vapor is generated by sputtering or evaporation of a target material that then condenses on the wafer surface. Applied has more than 25 years of experience in PVD technology development and holds undisputed market leadership in this segment.

PVD 沉積製程使用於建立超薄、超純金屬和過渡金屬氮化物薄膜可以為半導體製造的各種邏輯和記憶體應用。最常見的 PVD 應用是鋁板和焊盤金屬、鈦和氮化鈦線性層、阻障層沉積、以及用於連接金屬的銅阻障層種子沉積。

PVD 薄膜沉積需用一個高真空平臺,這裡的製程將脫氣和表面預處理技術相結合,以獲得最佳介面和薄膜品質。應用材料公司的 Endura 平臺是當今工業 PVD 金屬化的黃金標準。